Wafer manufacturing equipment for semiconductors and materials

We are capable of processing silicon ingots and other materials such as quartz and crystal, and have supplied numerous wafer fabrication equipment to the semiconductor, solar cell, and LCD industries.
The wire saw machine ensures high rigidity and static accuracy, and minimizes wafer waviness by utilizing tension control and thermal control technologies developed over many years.
Stable, high-precision machining reduces post-process work, and fine wire reduces material loss during machining. The fine wire reduces material loss during processing, improves yield, and brings high productivity to the customer's production line.

Komatsu NTC technology

Spindle assemblies and machine rigidity that produce high precision are cultivated on automobile production lines that operate 24 hours a day, and are manufactured with high precision by tension control.

Control technology

・Tension control technology
・Temperature control technology

Machine technology

・Structural analysis

Fine-line technology

・ Reduced material loss due to finer wire by adopting diamond wire

Product lineup

Wire saw

Ultra-precision surface grinder for semiconductors

■ Wire saw

Product name	Max. workpiece size (Diameter x Length x Number of workpieces) mm	Processing method	Machine size （W×D×H）mm
MWM442DM	Φ150 x L300 x 2pcs (Standard Specifications) Φ100 x L300 x 3pcs (Option) Φ200 x L300 x 1pc (Option)	Slurry	1,800 x 2,650 x 2,615
MWM3050nQ	Φ300 x L450 x 1pc	Slurry	2,000 x 3,550 x 3,500
ND200	Φ200 x L700 x 1pc (Standard specifications) Φ200 x L400 x 1pc (Equipped with gonio function)	Diamond wire	2,250 x 3,955 x 3,070
ND660	Φ660 x L500 x 1pc	Diamond wire	2,400 x 4,700 x 3,400
MWM11411	1,100 x 1,000 x L350 x 1pc	Slurry	5,000 x 6,400 x 4,400
MWM15413	1,610 x 1,410 x L350 x 1pc	Slurry	5,500 x 9,000 x 5,480