Wire saw ND660

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Dedicated diamond wire machine for large-diameter workpieces

Capable of processing large-diameter workpieces up to Φ660mm, and active in the quartz substrate for LCD and semiconductor target substrate industries

 

  • Diamond Wire Adoption
  • Wafer thickness can be changed
  • Reduction of running costs

Main features and specifications

Diamond wire specialized machine

  • High-speed machining is possible by adopting a fixed abrasive processing method using diamond wire. High productivity is also achieved by the high speed wire running speed.
  • Reduction of kerf loss by thinner wire. Material yield is improved.
  • Since slurry (loose abrasive) is not used, waste liquid treatment is not required, which is environmentally friendly and reduces treatment costs.

Cutting thickness can be changed

  • Optional wire-skipping mechanism can be attached to accommodate cutting thicknesses up to 80 mm.

Reduction of running costs

  • Tension control and wire path optimization reduce the number of guide rollers, thereby reducing wire usage and the risk of wire breakage.
　　　　
Max. workpiece size Φ600×L500×1pc
Wire running method Uni-directional / Bi-directional / Switchable
Max. wire speed 1,300 m/min
Tension range 35 ～ 120N
Wire storage capacity Φ0.35mm × 5.5km
Cutting feed speed 0.1 ～ 3.0 mm/min
Power source used 480V ± 10%
Power consumption 115 kVA
Compressed air used 600NL / min, 0.4MPa min
Equipped NC FANUC
Machine size (W×L×H) 2,400×4,700×3,400 mm
Machine weight 22,000 kg
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Wire saw ND660