Wire saw MWM3050nQ

> Product List

 

Stable, high-precision machining that produces high quality

In the semiconductor substrate industry, where high quality is required
Wire saws for 12-inch wafers with an excellent track record

 
  • Pursuit of high rigidity
  • Equipped with thermal control mechanism

Main features and specifications

Pursuit of high rigidity and high straightness

  • The machine rigidity is improved by FEM analysis to reduce machine deformation due to machining load and enable stable machining.
  • High straightness is achieved by adopting a linear guide that can withstand high loads and eliminating minute waviness.

Thermal control mechanism

  • Temperature sensors and cooling mechanisms are installed in the spindle unit and main roller. By arbitrarily controlling the spindle temperature during machining, thermal deformation of the machine, which affects machining accuracy, can be suppressed and machined shapes can be stabilized.
　　　　
Max. workpiece size Φ300×L450×pc
Wire running method Uni-directional / Bi-directional / Switchable
Max. wire speed 1,000 m/min
Tension range 15 ～ 34N
Wire storage capacity Φ0.14mm × 500km
Cutting feed speed 0.01 ～ 2.50 mm/min
Power source used 200V ± 10%
Power consumption 115 kVA
Compressed air used 600NL / min, 0.4MPa min
Equipped NC FANUC
Machine size (W×L×H) 2,000×3,550×3,500 mm
Machine weight 14,700 kg
Inquiry about our products
Service & support

Find Products & Solutions

Technology

True technology is the fruit of philosophy. Wisdom is the driving force of corporate development.
Based on the "sensitivity of a leading supplier" driven by these two, we will continue to steadily move forward at the forefront of the global stage.
Technologies owned by Komatsu NTC
Top Products & solutions Wafer manufacturing equipment for semiconductors and materials
Wire saw MWM3050nQ