Wafer inspection equipment

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Fully automated wafer inspection system for labor saving and quantitative evaluation

 

  • Consolidation of inspection processes
  • Excellent inspection capabilities
  • Equipped with NTC software
  • Improved usability

Main features and specifications

Consolidation of inspection processes

  • The combination of automatic transfer and image processing covers many of the wafer inspection items on a single machine. It reduces the number of machines and saves space.
  • Capable of performing multiple inspections including dimensional measurement, defect detection such as chips, pinholes, and foreign matter, as well as waviness and plate thickness measurement.

Equipped with NTC software

  • High-speed processing of image inspections is realized through the practical application of parallel image processing using proprietary software. 20 items can be inspected and discharged in 20 seconds/page.
  • Reduces CPU operating load. Reduces heat generation, prevents hardware deterioration, and contributes to lower running costs through power savings.

Excellent inspection capabilities

  • Special optics effectively eliminate patterns and adhering objects that interfere with inspection, ensuring that only defects are detected.
  • The outer edge of the wafer, which was considered an uninspected area, is now inspected.
  • In addition to wafer thickness and soermark, the laser sensor can also be used to measure resistivity and determine PN with optional equipment.

Improved usability

  • To prepare for inspection, simply load the workpiece into the cassette loader. Pressing the start button starts the inspection with fully-automatic conveyance, and OK and NG workpieces are sorted and discharged.
  • OK/NG judgment, NG type, and various measurement data can be checked in real time on the operation screen.
  • Images and detailed data can be retrieved at any time. Establishing traceability supports yield improvement.
*1 Machine size may differ from the description depending on inspection items.
*2 Inspection items not listed can be tailor-made.
Machine size (W×L×H) *1 3,600×1,200×1,900 mm
Max. workpiece size Φ300 mm
Inspection item *2 O.D. and corner dimensions, chipping/chipping, cotton stains on front and back, through/non-through cracks, pinholes, foreign matter, plate thickness, waviness/warping, soakmark, resistivity/PN judgment, life time, etc.
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